Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

What is Layer-by-Layer Assembly? Layer-by-layer (LbL) assembly is a technique for fabricating multilayered thin films by alternately depositing oppositely charged materials onto a substrate. This ...

Software automation in PCB assembly. Advantages and disadvantages of software automation in PCB assembly. The PCB assembly (PCBA) process is becoming more complex with evolving market trends such as ...

The Fast Company Executive Board is a private, fee-based network of influential leaders, experts, executives, and entrepreneurs who share their insights with our audience. BY Sviat Dulianinov The AI ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...