As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
The next phase of artificial intelligence is no longer just about faster GPUs. As AI moves from single-task generation to autonomous, multi-step "agentic" systems, the economic value is migrating to ...
TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...
China’s memory industry is no longer a distant follower. It is now fielding a pair of aggressive specialists that are starting to bite into the global market share long dominated by Samsung, Micron, ...
The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth memory ...
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on ...
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